[x3d-public] FW: DICOM Public Comment Solicitation- Supplement 205 DICOM Encapsulation of STL Models for 3D Manufacturing by Monday, January 22, 2018

Ryan, Justin jryan1 at phoenixchildrens.com
Mon Dec 11 07:17:43 PST 2017 

Friends and Colleagues in X3D Public List:

As of December 8, 2017, we have entered the phase of public comments on the STL encapsulation by DICOM. If you are unfamiliar with these efforts, they represent the intent of bringing STL files (eventually other 3D files) into the hospital infrastructure that already houses medical images (PACS).

This period lasts 45 days (ends January 22). Anyone (even non-DICOM voting members) are able to submit comments on the specification. Comments may be areas where you feel the specification inefficiently addresses medical needs or breaks existing workflows or interoperability. While DICOM is a living standard (it continually receives input and enhancements), we would appreciate feedback from the community to ensure it is strong initially. You may be asking why I am sending out an STL-encapsulation spec to the X3D community - this specification (if successful) will also serve as the framework for the remaining in-scope file specs: obj, vrml/x3d, and 3mf.

Below is a copy of the email from DICOM (sorry, it is very long); the email has the instructions on how to view the document as well as how to comment on it. We would greatly appreciate your input here!

Please let me know if you have any questions that I can answer.


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[cid:image002.jpg at 01D29DA3.311203E0]

Justin Ryan, PhD
Arizona State University Adjunct Faculty
Phoenix Children's Hospital Research Scientist



Phoenix Children's Hospital
Cardiac 3D Print Lab



p (602) 933-3902



Cardiac3DPrintLab.com<http://cardiac3dprintlab.com/>



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From: DICOM Secretariat [mailto:dicom at medicalimaging.org]
Sent: Friday, December 08, 2017 8:30 AM
To: DICOM Community Roster A (DoPseudoAddressNotReply at mita.org)
Subject: [EXTERNAL] DICOM Public Comment Solicitation- Supplement 205 DICOM Encapsulation of STL Models for 3D Manufacturing by Monday, January 22, 2018

**WARNING** This is an external email sent from: dicom at medicalimaging.org<mailto:dicom at medicalimaging.org>.

**DO NOT CLICK** links or attachments unless you recognize the sender.
________________________________

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PLEASE DO NOT CHANGE THE SUBJECT LINE WHEN RESPONDING!  Thank You!

To:      DICOM Community

Cc:                              Pro-Tem Chair of WG-06 - Bjorn Nolte
DICOM Editor - David Clunie

From:                         DICOM Secretariat Office
Luiza Kowalczyk, Senior Manager, DICOM Operations

Subject:   Soliciting Public Comments on Supplement 205 DICOM Encapsulation of STL Models for 3D Manufacturing


Submit comments as soon as possible but no later than by midnight Monday, January 22, 2018.

All interested persons are invited to comment.  Recipients of this solicitation should feel free to forward it to anybody who may be interested in this topic but may not be included in DICOM e-mail lists.
There is no cost or obligation associated with commenting and no membership in any committee is required to comment but commenters are requested to include their contact information with their comments.  The commenters are also invited to request to be added to the e-mail list of DICOM Working Group 06 (Base Standard) and DICOM Working Group 17 (3D Manufacturing). The latter Group is the author of this Supplement.  If added to the e-mail list, the persons will be kept appraised of further communications regarding this Supplement and other changes and updates of the DICOM Standard. (Visit the DICOM home page (http://dicom.medical.org) and click on the pink button to request to be added. (Note: one may request to be removed from the e-mail list(s) at any time as job assignments or interests may change.)
The Members of Working Group 6 (Base [DICOM] Standard), who are reviewing this Supplement, would appreciate any comments that you might like to make regarding its technical merits.

To facilitate the readers' understanding of this new proposed addition to the DICOM Standard, the authors prepared a presentation, which describes the technical issues and use cases.  The links to this Power Point description are also available in this document.


Scope and Field of Application
(Reproduced from the document for your convenience)

This supplement adds a new DICOM IOD to encapsulate Stereolithography (STL) 3D model file formats (see StereoLithography Interface Specification, 3D Systems, Inc., October 1989).

The new IOD allows 3D manufacturing models to be exchanged between various types of equipment using DICOM messages.  This adds the ability to store, query and retrieve 3D models as DICOM objects.   Updates are addressed by storing new instances, with reference back to earlier instances.

The 3D model files are a type of document that contains geometric instructions on how an object could be created by a 3D printer, milling machine, or other type of device capable of manufacturing a physical object.

To exchange these 3D models in an efficient manner in an imaging environment, especially as part of patient care planning and the patient's imaging record, it is useful to be able to "wrap" these model documents in a DICOM container.

Additionally, the identity of the patient (and any source image series) of the encapsulated 3D models can be ascertained through the attributes that the DICOM information model adds on top of the 3D model's general purpose geometric information.

Since its introduction, the STL file format has been used for a variety of applications, including 3D manufacturing.  STL is the most prevalent file format in the 3D printing community and enjoys wide support by existing systems.

STL supports both an ASCII and binary encoding. In the interest of simplicity and minimizing SOP Instance size, only the binary encoding of STL is supported for DICOM encapsulation. The binary STL format is simple enough to be described here as the following IEEE little-endian byte sequence:
80 Character Header = Not interpreted
UINT32 = Number of triangles
For each triangle
REAL32 x 3 = Normal vector coordinates
REAL32 x 3 = Vertex 1 coordinates
REAL32 x 3 = Vertex 2 coordinates
REAL32 x 3 = Vertex 3 coordinates
UINT16 = Reserved value. Always set to Zero in practice
end

All comments should be submitted as soon as possible but NO LATER than by midnight, Monday, January 22, 2018.

Who can comment? All interested persons are invited to comment.  Recipients of this solicitation should feel free to forward it to anybody who may be interested in this topic but not now on DICOM e-mail lists.  There is no cost or obligation associated with commenting and no membership in any committee is required to comment but commenters will be requested to include their contact information with their comments.
What will happen to your comments?  DICOM Working Group 6 and DICOM Working Group 17 will review the comments and discuss their resolution.   WG-06 is authorized by the DICOM Standards Committee to decide on the technical merits of the comments.


Instructions for accessing the documents and submitting comments:


  1.  The DICOM Secretariat (MITA/NEMA) uses a third party software, KAVI, for the collection and management of the public comments.
  2.  Download document(s) to local drives:
Click on the links below to download the PDF, Word, and/or XML versions.  If the PDF version is different from any other format the PDF governs.

  1.  Enter and submit comment(s):
When clicking on the "Comment" link below; the comment submission template appears.  You may complete multiple comment templates and submit as a single comment ("Save and add another") or you may submit a single comment ("Save") and restart the process to submit another comment.
Forms of comments:

  *   You may enter free text, attach a document containing your comments, or mark-up parts or the whole of the document and attach same.
  *   If your comments relate to several specific sections you can combine them in a single comment entry or make separate comment entries.

 Mandatory fields:

  *   Commenter's name, affiliation, e-mails address.
  *   "Subject" (please enter "Sup 205_PC' - [additional,  more specific description is optional]
  *   "Comment" - may be a higher level statement or may be detailed technical comment with tables, illustrations, 'cut-and-paste from the draft, etc.
  *   "Proposed solution" - may be a higher level statement or may be marked up or new text, tables, illustrations, etc.
  *   "Save and add another" -you may complete multiple comment templates and submit as a single comment
  *   "Save" - you may submit a single comment and restart the process to submit additional comments.

Notes for optional fields/items:

  *   "Category"  - would be most helpful, please complete!
  *   "Section" and "Item" very helpful for all comments.  However; may not be applicable to high level comments.
  *   "Supporting File" - may attach a document to the comment

[END OF NOTES AND INSTRUCTIONS]
'Download' links:

Sup205_pc_DICOM_Encapsulation_of_STL_Models for_3DManufacturing- PDF Document-
https://standards.nema.org/higherlogic/ws/public/document?document_id=20982&wg_abbrev=09-DICOM-2

Sup205_pc_DICOM_Encapsulation_of_STL_Models for_3DManufacturing - Word Document
https://standards.nema.org/higherlogic/ws/public/document?document_id=20984&wg_abbrev=09-DICOM-2

Sup205_pc_DICOM_Encapsulation_of_STL_Models_for_3D_Manufacturing_overview- PPT Presentation-

https://standards.nema.org/higherlogic/ws/public/document?document_id=20983&wg_abbrev=09-DICOM-2


'Comment' link:

Sup205_pc Submit Comments -

https://standards.nema.org/higherlogic/ws/public/add_comment?document_id=20982


PLEASE NOTE:

The draft Supplement 205 PC and the accompanying Power Point presentation are also posted in ftp://medical.nema.org/MEDICAL/Dicom/Supps/PC/

If you still have questions and need assistance to complete and submit a comment, contact the NEMA web master (Victor.Carneiro at nema.org<mailto:Victor.Carneiro at nema.org> ) or the undersigned DICOM staff.

Sincerely,

Luiza Kowalczyk
Senior Manager, DICOM Operations
(Digital Imaging and Communications in Medicine)
c/o Medical Imaging & Technology Alliance (MITA)
A Division of NEMA, The Association for Electrical Equipment & Medical Imaging Manufacturers
1300 North 17th Street, Suite 900
Arlington, VA  22209, USA
Phone: +1-703-841-3259
Cell: +1-703-655-9911
Skype: luizako23
Fax: +1-703-841-3359
lkowalczyk at medicalimaging.org<mailto:lkowalczyk at medicalimaging.org>
http://dicom.nema.org<http://dicom.nema.org/>
If anyone you know is interested in receiving e-mail information on the latest changes to the DICOM Standard or is interested in actively participating in any DICOM Working Group, please direct them to
http://dicomconference.org/contact/participation-in-dicom-activities/
























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